Product Series Features:

• Pressed rake face geometry promotes efficient chip formation
• Integrated wiper flat on face for producing surface finishes as good as 32 Ra
• Designed for multiple materials and applications
• 2 Indexes
• Fits series 2S-TE90AP cutters

Notes:

• **Note, OBSOLETE product line.
• Refer to the following for stocked alternatives:
• HiPosSFeedV, series 12J1A
• HiPosTrio, series 1KJ1B or 1KJ1D
• DiPosDuo, series 1TJ1B or 1TJ1D
• DiPosTetra, series 1TJ1C
• HiPosMicro, series 12J1D